Description:
Product Name: Cu SiC HTC And LTE Packaging Materials Ceramics
Company Name: SUZHOU TUOCI TECHNOLOGY CO.,LTD
Address: No. 266, Jingang Road, Zhangjiagang Free Trade Zone
Description: 1. Compared with copper alloy and aluminum silicon carbide, it has higher thermal conductivity. 2. Compared with copper alloy and aluminum silicon carbide, the material has a lower coefficient of thermal expansion. 3. Compared with copper alloy and aluminum silicon carbide materials, it has higher stiffness.
Contact: Latzgr Kxbi
Telphone: 86-0319-57467120
Fax: 86-0319-57467120
Email: tuocitech@163.com
Company Website: http://www.tuocitech.com
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